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Holes, wrinkles edge cracks, inclusions, contaminants, coating voids, scratches , spots and dents
Variety of materials
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Insufficient Soldering Paste
Missing components
Rotated components
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Accuracy level of 1 micron
PCB, BA, AOI/AXI, ball-wedge & wire bonding machines
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Bar codes & OCR
Superior edge detection for high measurement accuracy
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